Intern 6, Packaging Engineering

Job Description You will work as intern role in Assembly PIE (packaging integration engineering) Team. Major focus on new product packaging development and support PIE team on new product development activity. During support PIE on new product Package development, performance monitor and system maintenance will be key focus: Work closely with both internal team and cooperate team on product yield tracking and drive for yield improvement. Setup new product assembly process flow and manage new product BOM. Prepare product design DOE material and monitor progress Maintain new product related system and enhance function Qualifications Bachelor or Master Students major in Computer Science, Material Science, Mechanical Engineering or other engineering areas Interested on Packaging engineering R&D and data analysis  Prefer to have some experience on one programming language such as Python, Java, C+, Swift etc Work at least 3 days per week, continue 5-6 months Additional Information Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution. Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at jobs.accommodations@sandisk.com to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.