Principal Analog Mixed-Signal Design Engineer

Principal Analog Mixed-Signal Design Engineer





Direct Hire





Salary - $145k to 215k/year





Job Summary:





Our client's Broadband Analog group designs physical layer ICs for high-speed fiber optic data communication, such as Transimpedance Amplifiers (TIAs), and drivers for Silicon Photonic (SiPho) and discrete Electro-absorption Modulators (EAMs) and Mach-Zehnder Interferometer Modulators (MZMs).





This group is the market leader in delivering TIAs and Drivers for Data Center and Telecom markets.





They address the bandwidth, capacity, and power issues faced by cloud computing and mega data center networks.





Our world-class group leverages our core competencies in advanced circuit design to solve the world's ever-increasing desire to transmit more data for less power with fewer errors.





Our client is continually first to market in Data Center, Metro, and Long-Haul applications.





As a member of the design group, the Principal Analog Mixed-Signal Design Engineer will be responsible for the design and validation of FET and BiCMOS circuits for high-speed broadband ICs that serve these applications.





What You Can Expect





Our client is seeking an RF and Analog Design Engineer to contribute to the development of multi-tens GHz Transimpedance amplifiers TIAs.





These optical interface chips are tightly coupled with our high-performance equalizers.





The results of our innovative designs have made our TIAs best in class for coherent long-haul and metro systems as well as PAM4 data center systems.





Job Responsibilities:





In this role, Principal Analog Mixed-Signal Design Engineer will be responsible for:





Active circuit design as well as technical leadership.





Design leading edge trans-impedance amplifier design, primarily in Silicon Germanium (SiGe) BiCMOS (Bipolar Complementary Metal Oxide Semiconductor) technology, where circuit performance will need to transcend beyond industry-leading products.





Develop transmission line structures and other millimeter wave structures to enable higher performance than would normally be achievable.





Design of hi-performance broadband analog circuits for optical front-end receivers.





Design of various other analog circuits including linear regulators, AGC loop, current/voltage sensors, bandgaps, etc.





Develop microarchitecture of major circuit blocks and guide a team of designers to implement them. Work with various technologies including SiGe BiCMOS and CMOS.





Work with other functional groups to facilitate post-silicon validation, qualification, transition to mass production, and customer support.





Job Requirements:





Bachelor's degree in Electrical Engineering in the areas of design of high-performance RF/Analog Receiver/TIA design and 10 - 15 years experience Or MSc EE Or PhD EE with 5+ years of experience in the areas of design of high-performance RF/Analog Receiver/TIA design.





Proven experience in IC design including chip tape-out AND lab evaluation of receiver design working in the industry).





Solid experience in.





Using EDA CAD tools





Performing Analog Custom Layout





Experience in measuring IC performance and debugging design to correlate simulations to measurements





Deep understanding of fundamentals, including:





Detailed transistor-level design





Device physics





Control/Feedback loop stability analysis





Direct project experience in at least one of the following areas is a plus:





AGC loop design





High-precision analog circuits (Including linear regulators, current sensors, bandgaps, and DAC/Client)





Experience in CTLE design





Experience in Package-System integration issues desired





Project experience in using different technologies. (SiGe BiCMOS is a plus)





A team-player





Experience in the following is a strong plus:





Overseeing and mentoring junior circuit designers





Experience as chip lead with success in silicon





Experience in taking chips to mass production





Ability to translate chip-level specifications into architecture





Strong communication, presentation, and documentation skills.





Location:





Westlake Village, CA, US





Benefits:





Medical, Vision, and Dental Insurance Plans





401k Retirement Fund





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