Product Development Senior/Engineer (PDE CEM)

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.JR48927 Product Development Senior/Engineer (PDE CEM) (Evergreen)As a PDE CEM Engineer you will be primarily responsible for developing and optimizing processes to meet the schedule of business cases. To work on new product introduction and improving the yield, quality and reliability with process characterization and optimization and new materials, machines & technologies introduction. You need to perform DOE and handle the NPI runs for the recipe creation and verification to verify the process performance and collect the data to reports. You will also be required to identify, diagnose, and resolve assembly process related problems by applying problem solving skills.Job Responsibilities:Execute smooth transfer of new products and packages from NPI to HVM siteWork with cross functional team and sites to execute smooth products transferValidate and document baseline the POR, TOR and BOM for the transferred products and packagesExecution of the qualification of NPI packages build that proliferate from the pilot products and packages according to planned timelineExecution of NPI Customer samples and Engineering Samples build for new products and packages according to planned timelineEvaluate and Improve Assigned Assembly Processes, Materials, and/or EquipmentParticipate in process,tooland material optimization to drive best in class packaging solutions and ensure first pass NPI qualification. Provide ideas for cost reductionMaintain in-depth assembly process and packaging knowledge, included materials and equipment knowledge as packaging integration. Identify all process variables, and Optimize process and/or equipment variablesPerform containment of process and equipment deviations, and lead root cause finding and implement corrective actionsDevelop Process of Record (POR), define process edges and center the process (CPK), Apply DOE (Design of Experiments) techniques for process characterizationDevelop Process Capability Roadmap and Evaluate Equipment and/or Material TechnologiesJob Requirements:Masters or bachelor’s degree in an EngineeringExperience in backend engineering process or assembly package technology development preferredAt least 3 years experience in semiconductor industry and candidates with proven experience in wire bond, die attach, encapsulation, post-encapsulation, wafer are highly encouraged to apply.Excellent problem-solving skill, and good in data analysis, statistical analysis, data interpretation skillsA good team player equips with excellent interpersonal and communication skills.Highly result driven individual, self-motivated and ability to multi-task and manage dynamic priorities