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SiC Equipment Engineering - Wafer Laser Splitting & Finishing M/F

OUR STORY At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society. We are a global semiconductor company, and our advanced technology & chips forms the hidden part of the world we live in today. When you join ST, you will be part of a global business of more than 115+ nationalities and present in 40 countries, 50,000+, diverse and dedicated creators & makers of technology around the world! Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and desire to disrupt the status quo, push boundaries and drive innovation – whilst unlocking your own potential. Working at ST means innovating for a future that we want to make smarter, greener, in a responsible and sustainable way. Our technology starts with you. Join us and start the future! You will be a key contributor to SiC Technology volume ramp-up in ST. The work location will be in the new mass-production fab in Catania for the manufacturing of SiC substrate wafers, this facility will be a first of a kind in Europe for the production in volume of SiC epitaxial substrates, integrating all steps in the production flow. Your main focus will be in the Wafer Laser Splitting and Finishing group with the following tasks: KEY RESPONSIBILITIES Hands-on work with processes and tools used in SiC semiconductor technology Be active part of the new Fab start-up, supervising equipment installations with a strong interaction with suppliers Ensure equipment robustness and stability by managing equipment control charts, tool alarms, fault detection Build an effective preventive maintenance plan and schedule of the new tools Monitor of tools performances in the production environment and perform troubleshooting on equipment faults, providing reports. Review tool spare parts list, classifying by impact on production and delivery time Create and review Equipment FMEA and establish action plans and new strategies to improve equipment robustness Optimize equipment performance to improve overall efficiency, quality, cost and cycle time, collaborating with the Process Eng team. Train new employees (technicians and maintenance engineers) Collaborate with Hook-up team for layout definition/changes and for auxiliaries optimization Develop and improve machine automation to help volume ramp-up YOUR SKILLS Both junior and senior profiles will be evaluated, with the following background and characteristics: PhD or Master in scientific faculty, e.g. in Engineering, Material Science, Physics, Chemistry Experience in silicon processing and flow knowledge is a plus Precision, attention to details and good manual skills Fluent English is a must Good communication skills and able to work in a team Committed, Proactive and Curious The Employment search is addressed to candidates of both genders, under Law 10.04.1991 n. 125, as amended by Legislative Decree n. 198/2006 which guarantees gender equality at work. We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Diversity, Equity and Inclusion (DEI) is part of our company culture. Our DEI vision is, “At ST, you can be the true version of yourself”, we value all employee contributions and have zero tolerance for any kind of discrimination. Joining us is also about a greater work-life balance and workplace with equal opportunities. Dedicated Employee Resource Groups for women and LGBTQIA+, hybrid work arrangements are amongst the many DEI & Sustainability initiatives that make us a great place to evolve your career. To discover more, visit st.com/careers #J-18808-Ljbffr

SiC Equipment Engineering - Wafer Laser Splitting & Finishing M/F

STMicroelectronics
Catania, Province of Catania
Full time

Published on 10/25/2024

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