Staff PKG Development Engineer

Responsibilities : Develop and integrate new semiconductor packaging technologies. Manage technical projects for packaging technology advancement. Serve as a lead expert in packaging assembly processes, especially SMT. Innovate in package design, processes, and materials for next-generation solutions. Offer technical guidance during development phases and address high-volume production challenges. Spearhead projects from concept through to qualification and production in collaboration with R&D. Support technical customer engagements and problem resolution. Drive continuous process improvement (CPI) in packaging and support cross-functional areas. Collaborate with offshore assembly, substrate partners, and suppliers. Present project updates to executive management and contribute to patent creation. Qualifications: Bachelors degree in Mechanical, Microelectronics, or Materials Engineering. Master’s degree in Mechanical, Microelectronics, or Material Engineering preferred . 10+ years experience in packaging or semiconductor assembly. Strong leadership and project management skills in packaging and assembly tech. Expertise in package design and SMT process development. Experience with heterogeneous integration, SiP, and various packaging forms. Proficiency in technology/assembly process development across SMT, Die Attach, Wire Bond, etc. Exceptional communication skills for idea sharing and presenting to large groups. Familiarity with high volume manufacturing, ideally in the cellular handset market. Solid problem-solving skills; Lean and/or Six Sigma certification is a plus. Knowledge of JEDEC, AEC Q100/200, and TS16949 automotive standards. Application: Interested candidates are encouraged to apply, demonstrating their innovative contributions to packaging technology and leadership capabilities.